TEL NEXX, Inc. is a worldwide leader in advanced packaging semiconductor equipment products and services. Our mission is to continually improve our products and services to exceed our customer's expectations, allowing us to prosper as a business, to provide a reasonable return to our shareholders, and to ensure a challenging and exciting work environment for our employees.
TEL NEXX, Inc. maintains a global presence with sales and service locations based throughout the United States, Europe, Singapore, Korea, China and Taiwan, providing customer support worldwide. We are committed to helping our customers maximize productivity and improve yield and tool availability through increased uptime. An install base of over 148 systems, serving over 41 customers around the globe and a high percentage of repeat customers, gives testimony to TEL NEXX, Inc.'s unrivaled customer service.
TEL NEXX, Inc. was established in May 2012 as a wholly owned subsidiary of Tokyo Electron. TEL NEXX delivers leading-edge, cost-effective advanced packaging equipment to semiconductor manufacturers innovating in wafer level packaging. NEXX Systems was founded in August 2001 to focus on sputter deposition systems for PVD of thin films. With the aquisition of All-Wet Technologies in April 2003, NEXX Systems enhanced its product offering to include leading edge, low cost, high performance electrodeposition technology for metal and photoresist.